Contract manufacturing of machining and equipment design.
We will undertake a wide range of manufacturing contracts, including machining of cutting parts, paper transport control, wafer transport control devices, FA-related equipment, semiconductor manufacturing-related equipment, and liquid crystal manufacturing-related equipment.
Our company provides total support for customer needs, from product development to manufacturing inspection, centered on our development and manufacturing technology capabilities in electronics and mechatronics. ■ Areas of Expertise 【Precision Cutting】 High-precision, high-quality cutting parts made from aluminum, stainless steel, titanium, and engineering plastics, among others. ◆ High-precision components for semiconductor and LCD-related equipment ◆ Metal parts for optical communication systems ◆ Component parts for OA peripheral terminal equipment 【Equipment Design/Assembly】 ◆ Mechanical and Control Design Design of various tools and semiconductor/LCD manufacturing and inspection equipment - Mechanical and control design for wafer and cassette transfer machines - Design for FOUP and SMIF compatibility - Design of various loader/unloader devices - Design of various production and inspection equipment - Tooling design ◆ Equipment Assembly From unit manufacturing to equipment manufacturing for semiconductor/LCD manufacturing and inspection equipment Manufacturing of semiconductor/LCD transport robots - Manufacturing of various production and inspection equipment - Manufacturing of OA equipment 【Repair and Overhaul】 Repair and maintenance of financial terminal devices, transmission terminal devices, etc. - Financial terminal devices Voucher, passbook printers, cash deposit and withdrawal machines - Core transmission devices Analog communication, digital communication, optical communication - Transmission terminal devices MODEM, SDSL, CATV
- Company：ワイ・デー・ケー
- Price：Other
